Textul licitației

o handle the wafers, programmable automatic wafer scanning system, and analysis software. The tool should be designed to be used inside the clean room. The supplier will take to consideration the environmental conditions of the tool installation location and will work together with VTT to reduce the external impact on facility. The automated thin-film stress analysis system is for non-patterned, non-texture 200 mm wafer stress measurement. The technical specification of the object of the tender and its minimum requirements is described in more detail in this Annex 1 of the invitation to tender. The tendered Tool must comply with all technical properties and functionalities, performance specifications and acceptance criteria as set out in Annex 1 and Annex 2 (“Facilities, materials and connector types”). A tender which does not meet one or more of the requirements specified in the Ann