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sputtering (HiPIMS) modes. Key feature of the deposition chamber will be the ability to accommodate and deposited homogeneously on substrates with diameter up to 8 inches (203.2 mm). A quick access port for loading and unloading substrates with a diameter up to 8 inches (203.2 nm) to the deposition chamber will be available. Moreover, the chamber design will allow provisionally for future functional expansion including installing a thermal evaporator for thin film deposition and a load-lock chamber for transferring samples to the deposition chamber without vacuum cycle interruption. RFMS and HiPIM power supplies, as well as instrumentation for thin film thermal evaporation, and load-lock chamber are not part of this tender. HAL is a leading materials science environment in Finland. The current research at HAL focuses on materials of importance for nanotechnology, micro- and optoelectroni